View TDA1575T_409594.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA1575T FM front end circuit for CENELEC EN 55020 applications
Preliminary specification Supersedes data of October 1990 File under Integrated Circuits, IC01 April 1993
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
FEATURES * Bipolar integrated FM front end circuit, designed for use in car radios and home receivers * Fulfils CENELEC EN 55020 requirements * Radio frequency range of 76 to 90 MHz (Japan) or 87.5 to 108 MHz (Europe, USA) * Low noise oscillator, buffered oscillator output * Double balanced mixer * Internal buffered mixer driving * Linear IF amplifier, suitable for ceramic IF filters * Regulated reference voltage. QUICK REFERENCE DATA SYMBOL VP IP VREF ZI NF EMF1 VOSC THD Gv NF ZI ZO EMF2 supply voltage supply current, without mixer reference voltage output mixer input impedance noise figure of mixer 3rd order intermodulation oscillator buffer output signal (RMS value) total harmonic distortion IF gain IF noise figure IF input impedance IF output impedance AGC wideband threshold (RMS value) PARAMETER 7 - - - - - 75 - - - - - - MIN. TYP. 8.5 23 4.2 14 9 115 - -15 30 6.5 300 300 17 - - - - - - - - - - - -
TDA1575T
MAX. 10 V
UNIT mA V dB dBV mV dBC dB dB mV
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA1575T Note 1. SOT109-1; 1996 August 29. PACKAGE PINS 16 PIN POSITION mini-pack MATERIAL plastic CODE SOT109A(1)
April 1993
2
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
TDA1575T
Coils TOKO L1: MC-108 514 HNE-150023S14; L = 78 nH, N = 4 turns L2: MC-111 E516 HNS-200057; L = 80 nH L3: A119 ACS-17114 FTT
Fig.1 Block diagram and test circuit.
April 1993
3
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
PINNING SYMBOL MIXI1 MIXI2 AGCI GND VREF OSCO OSCI1 OSCI2 LO IFO IFI1 IFI2 VP MIXO1 MIXO2 AGCO PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION RF input 1 to mixer RF input 2 to mixer HF input to automatic gain control ground (0 V) reference voltage output oscillator output oscillator input 1 oscillator input 2 buffered oscillator output linear FM IF output FM IF input 1 FM IF input 2 supply voltage (+8.5 V) mixer output 1 mixer output 2 automatic gain control output
TDA1575T
Fig.2 Pin configuration.
LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VP V14, 15 Ptot Tstg Tamb VESD supply voltage (pin 13) voltage at mixer output total power dissipation storage temperature range operating ambient temperature range electrostatic handling (see note 1) all pins except 3 and 10 pin 3 pin 10 - - - - - Note to the limiting values 1. Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. 2000 +2000 -1000 +1500 -2000 V V V V V PARAMETER 0 0 0 -55 -40 MIN. 12 VP 380 +150 +85 MAX. V V mW C C UNIT
April 1993
4
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
TDA1575T
CHARACTERISTICS VP = 8.5 V and Tamb = +25C, measurements taken in Fig.1 with f0 = 98 MHz (EMF1) unless otherwise specified. SYMBOL VP IP VREF Mixer I14+15 V1,2 Z1,2 V14,15 C14,15 GP EMF1IP3 NF mixer supply current (pins 14 and 15) DC voltage input (pins 1 and 2) input impedance DC output voltage (pins 14 and 15) output capacitance conversion power gain 3rd order intercept point noise figure total noise figure Oscillator V7,8 V6 f DC input voltage (pins 7 and 8) DC output voltage (pin 6) residual FM at pin 6 f = 300 to 15000 Hz; de-emphasis 50 s RL= 500 ; CL= 2 pF - - - 1.3 2.0 2.2 - - - V V Hz including transforming network note 1 - - - 4 - - - - - 4 1 14 - 13 14 115 9 11 - - - 10 - - - - - mA V V pF dB dBV dB dB PARAMETER supply voltage (pin 13) supply current reference voltage (pin 5) without mixer I5 3 mA CONDITIONS 7 16 3.9 MIN. TYP. 8.5 23 4.2 MAX. 10 30 4.4 UNIT V mA V
Oscillator buffered output (pin 9) VO V9 R9 THD fS output signal (RMS value) DC output voltage DC output resistor total harmonic distortion spurious frequencies EMF1 = 2 V; RS = 50 ; fOSC = 108.7 MHz 75 - - - - - 6 950 -15 -37 - - - - - mV V dBC dBC
Automatic gain control (AGC) R3 C3 V16 I16 EMF2 input resistance (pin 3) input capacitance AGC output swing (DC) output current at I3 = 0 output current at U3 = 2 V threshold (RMS value) Figs 3 and 4 V16 = 12VP V16 = 7 to 10 V I16 = 0; V16 = 12VP; Figs 4 and 5 - - 0.5 -25 2 - 4 3 - -50 - 17 - - -150 5 - k pF A mA mV
VP - 0.3 V
April 1993
5
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
SYMBOL Linear IF amplifier V11,12 Z12-11 C12-11 V10 Z10 C10 VO Gv Gv NF Note 1. GP = 10 log (4Vo mix x10.7 MHz) / (EMF2 x 98 MHz)2 x (RS1 / RML). DC input voltage (pins 11 and 12) input impedance input capacitance DC output voltage (pin 10) output impedance output capacitance output signal (RMS value) IF voltage gain (20 log (V10-4 / V12-11)) IF voltage gain deviation noise figure Tamb= -40 to +85 C RS = 300 -1 dB compression PARAMETER CONDITIONS IF = 10.7 MHz - 240 - - 240 - - 27 - - 1.25 300 13 4.4 300 3 - 30 0 6.5 MIN. TYP.
TDA1575T
MAX. - 360 - - 360 - 650 - - -
UNIT
V pF V pF mV dB dB dB
Fig.3
AGC output voltage V16 as a function of Vi3 RMS at I16 = 0, measured in test circuit Fig.1.
Fig.4
AGC output current I16 as a function of Vi3 RMS at V16 = 8.5 V, measured in test circuit Fig.1.
April 1993
6
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
APPLICATION INFORMATION
TDA1575T
Operating characteristics Measured in application circuit Fig.7, according to "CENELEC EN 55020, Chapter 4.1 (passive interference suppression)". Measurements are shown in Figs. 8 and 9. SYMBOL VS IS fRF Vtune G Vi ant IR RSS DBS PARAMETER supply voltage total supply current tuning range of RF input tuning voltage of RF input gain (20 log VO IF / Vant) input sensitivity image rejection repeat spot suppression double beat suppression DBS1 DBS2 DBS3 CBS continuous beat suppression S/N = 26 dB; Rant = 150 f = 98 MHz f = 98 MHz; Vi ant = 10 V f1 = 93 MHz; f2 = 98 MHz ftune = 88 MHz ftune = 103 MHz ftune = 90.15 MHz f1 = 90 MHz; f2 = 100.7 MHz ftune = 95 MHz - - - - 81 80 85 90 - - - - dB dB dB dB CONDITIONS 7 - 87.5 1 - - - - MIN. 8.5 37 - - 43 2 64 89 TYP. 10 - 108 7 - - - - MAX. V mA MHz V dB V dB dB UNIT
SG1: Wanted carrier; modulated with f = 1 kHz, f = 40 kHz (for audio reference) SG2: Unwanted carrier; modulated with f = 1 kHz, FM: f = 40 kHz (in band) or AM: m = 80% (out of band) increase level of SG2 until S/N = 26 dB w.r.t. wanted modulation (for car radio, home radio S/N = 40 dB)
Fig.5 Set-up for CENELEC EN 55020 passive interference measurements.
April 1993
7
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
TDA1575T
Fig.6 PCB layout of FM front end unit.
April 1993
8
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
TDA1575T
April 1993
9
Fig.7 Application circuit of FM front end with TDA1575T and FET-preamplifier.
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
TDA1575T
Fig.8
Interference level as a function of detuning for S/N = 26 dB; IN-BAND passive interference (CENELEC EN 55020).
Fig.9
Interference level as a function of detuning for S/N = 26 dB; OUT-OF-BAND passive interference (CENELEC EN 55020).
April 1993
10
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
TDA1575T
Fig.10 Internal circuits.
April 1993
11
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm
TDA1575T
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
April 1993
12
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA1575T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
April 1993
13
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1575T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
April 1993
14
Philips Semiconductors
Preliminary specification
FM front end circuit for CENELEC EN 55020 applications
NOTES
TDA1575T
April 1993
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/00/03/pp16
Date of release: April 1993
Document order number:
9397 750 02439

▲Up To Search▲

Price & Availability of TDA1575T

	To Download TDA1575T Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .